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EEF, SIEMENS and PI UK speakers at the UK’s largest advanced engineering show

Advanced Engineering 2017 today announced a raft of speakers and conference topics, including talks from Siemens and PI UK. Topics will include how specific engineering problems have been overcome, as well as more strategic issues such as the fourth industrial revolution, smart factories and additive manufacturing.

During the two-day open conference, visitors will be able to hear from leading names within the connected manufacturing industry covering thought-provoking topics that affect the industry every working day. On day two the Engineering Employers Federation (EEF) will be taking to the stage to discuss ‘Leading factories of the future. How the fourth industrial revolution (4IR) is shaping a new leadership and skills dimension’.

Other topics will include:

  • Paul Hingley, SIEMENS – Digitisation Keynote;
  • Derek Paul Lane, WAGO Ltd and PI UK – PROFINET, the backbone of IIoT and Industry 4.0;
  • Russell Smith, Balluff GmbH and PI UK – IO-Link, the enabler for Industrial IoT and Industry 4.0 strategies;
  • Tim Andrews and Junuz Jakupovic, Manufacturing Technology Centre (MTC) – SME support for digitalisation;
  • Simon Hall, Department for International Trade – DIT strategy & overview;
  • Grant Coffin, Rockwell Automation – Time To Value: implementing I4.0 solutions in the real world;
  • John Kirven, Canon (UK) Ltd – How the most successful manufacturers create customer intimacy, attract talent, and enable their teams;

Issues will also be covered by University of Manchester, HSSMI, techUK, Magna International, LPW Technology and Doncasters UK Fabrications Ltd.

The show is newly ‘Continuing Professional Development (CPD)’ – accredited for this year, by the CPD Certification Service. Recognised by employers, and which complements the policies of professional institutes and academic bodies, it also acknowledges the effective professional development visitors to the conference can gain. Attending the conference will help visitors broaden their knowledge around the various advanced engineering sectors and the interesting and technical topics that will be discussed.

Advanced Engineering 2017 is the place where the UK supply chain meets face-to-face with engineering management, spanning: process, control and plant industries; R & D; design; test; production & procurement from OEMs, integrators and top-tier industry players within multiple industries. It takes place on 1&2 November at the NEC, Birmingham.

Alison Willis, industrial divisional director at Easyfairs, the organisers of the exhibition, said: “We’re very excited about the speakers at this year’s exhibition; with presentations from Boeing, SIEMENS, Canon and Magna we’re set to have an interesting two days!

“The conference will provide insights into topics affecting the array of industries our show covers. We have something for everyone and expert industry keynotes will allow for interesting discussions and Q&As, especially around the hot-topic of industry 4.0.”

Advanced Engineering 2017 comprises five co-locating zones:

  • Aero Engineering
  • Composites Engineering
  • Automotive Engineering
  • Performance Metals Engineering
  • Connected Manufacturing

New for this year: a dedicated zone for industry 4.0, Connected Manufacturing (where PI UK are on stand CM35); and an expanded zone for start-ups sponsored by Magna International.

Now in its ninth year, the show is set for record-breaking visitor numbers, bringing together over 700 exhibiting firms – all looking to source, specify and invest in the most up-to-date products and explore the latest industry innovations.

More Information

For more information on Advanced Engineering, or to secure your free ticket for the show, visit: www.advancedengineeringuk.com. Find regular updates on Twitter via #AEUK17.

Visit us and gain access to the latest industry intel, supply chain opportunities and new technology and innovations #AEUK17 @advancedenguk Register now!

 

Source thousands of engineering products under one roof. Join us on stand CM35 – free registration now open #AEUK17 @@advancedenguk Register now!

 

See applications of the latest advanced engineering technology and processes: showcased and presented by experts #AEUK17 @advancedenguk Register now! #PI UK is on stand CM35

 

PI UK is on stand CM35. Also presenting in tech sessions: 6 Forums, over 200 sessions and free to attend to all registered visitors: Register now #AEUK17 @advancedenguk Register now!

 

Enabling Innovation showcase – experience the latest disruptive technologies from 50 UK start-ups #AEUK17 @MagnaInt ‏@advancedenguk Register now!

 

The IO-Link community has founded a technical working group for specifying the integration of IO-Link into OPC UA based on existing use cases.

io link companion std

A final proposal for the companion specification is to be available before the end of 2018.

The Industry 4.0 platform sees OPC UA (from OPC Foundation) as a suitable architecture model for implementing consistent integration of IT on the field level. This is why a corresponding standard for a data and function model is now being developed within the framework of the IO-Link community so as to accurately represent future IO-Link Devices and IO-Link Masters in OPC UA. This approach follows the general recommendation for developing OPC UA Companion Standards.

Over the past few years, IO-Link as a point-to-point protocol for sensors and actuators has been able to solidly establish itself and increase its presence. It is manufacturer independent (and thus field bus independent), has come to support more than 4,500 devices and enjoys steadily increasing acceptance.

Through the use of corresponding logic, so-called “IO-Link Masters”, IO-Link sensors and actuators can be connected to the various different field bus systems without further adjustment. Such masters can even be economically integrated into simple devices today. IO-Link thus offers the opportunity to access a very broad range of sensors and actuators in a standardized way and fieldbus independent.

As Industrie 4.0 efforts progress, it is also necessary to semantically incorporate IO-Link Devices into systems on a higher level than the field bus in order to evaluate sensor data. This functionality is often designated as a “sensor to the cloud” to express that sensor data is analyzed by IT systems outside the automation process. In this way, sensor data can also be seamlessly linked to MES and ERP systems.

The goal of this new IO-Link/OPC UA working group (C4/PG51), lead by Michael Tiegelkamp (TE Connectivity), is to complete a final proposal for the Companion Specification (draft for voting) before the end of 2018.

More information on PI’s IO-Link technology can be found at http://www.profibus.com/technology/io-link/

 

About IO-Link and PI UK

During 2016 the IO-Link grew to 5.3 million nodes, showing just how much interest there is in the technology, managed through the auspices of PROFIBUS & PROFINET International (PI).

In the UK, PROFIBUS & PROFINET International is represented by PI UK. Funded entirely by member subscriptions, our mission is to support UK industry in taking advantage of the opportunities for increased productivity, lowered costs and global standards afforded by embracing PROFIBUS, PROFINET and IO-Link. Membership is open to any person or company with an interest in open standard industrial communications.

More information is available on PROFIBUS, PROFINET and IO-Link from http://www.profibus.com, PI’s global website, where technical, marketing and sales information can be found, plus an on-line catalogue of over 2500 products.

We are starting a new email newsletter service. To join the list, you can sign up safely at http://visitor.constantcontact.com/d.jsp?m=1102664683608&p=oi

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